UKUHLANGANISA IZINDLELA NEZIXWAYISO ZAMANDLA SEMICONDUCTOR HEATSINK

I-heatsink iyithuluzi elidingekayo lokupholisa idivayisi ye-semiconductor yamandla njengohlobo lwe-disc nohlobo lwemojuli ye-thyristor ne-diode ngomoya ophoqelelwe noma amanzi.Ukuze ugcine ukusebenza okuvamile nokuthembekile, kuyadingeka ukukhetha i-heatsink efanelekile futhi uyihlanganise kahle.Izindlela eziyinhloko nezixwayiso zokuhlanganisa ama-heatsink alandelayo:

1. Qinisekisa ukuthi i-polarity yomhlangano ilungile (bheka izithombe zokufakwa kwe-heatsink ehlukahlukene), izesekeli ziphelele, futhi ingcindezi ihlangabezana nemithethonqubo (bheka ithebula elingezansi), uma kukhona fan, isiqondiso se-fan. kufanele ilungile.

Usayizi Wedivayisi(indawo yokuxhumana) mm

I-Preset hydraulic press pressure(MPa)

I-Torque (Nm)

Usayizi Wedivayisi(indawo yokuxhumana) mm

I-Preset hydraulic press pressure(MPa)

I-Torque (Nm)

Φ25.4

3.4×(1±10%)

10±1

Φ55

14.4×(1±10%)

60±2

Φ29.72/30

5.5×(1±10%)

18±1

Φ60

14.9×(1±10%)

65±2

Φ35

7.5×(1±10%)

22±1

Φ63.5

15.4×(1±10%)

70±2

Φ38.1/40

8.5×(1±10%)

25±1

Φ70

16.2×(1±10%)

75±2

Φ45

12.3×(1±10%)

35±1

Φ76

19.2×(1±10%)

90±2

Φ48

13×(1±10%)

40±2

Φ89

24.2×(1±10%)

100±2

Φ50.8

13.7×(1±10%)

50±2

 

 

 

2. Ubude be-screw bulinganisiwe, futhi ngemva kokucindezela kokuqina kusetshenziswe, i-screw iphuma amazinyo angu-2-3 kusuka ku-nut ilungile.

3. Izingxenye ze-insulation ziqinile ngaphandle kokuqhekeka noma ukulimala.

4. Ibanga eliphakathi kwamabha ethusi lihambisana nezindinganiso (bona ithebula elingezansi), futhi ibanga elifanele phakathi kwama-fins we-SF series air-cooled heatsink ngu-14-18mm.

4.1 Ibanga phakathi kwamabha ethusi ochungechunge lwe-SF

Amamodeli

Ibanga Eliphakathi Kwezingqimba Zethusi (mm)

SF12

21-26

SF13

21-26

SF14

44-49

SF15

49-54

SF16

65-70

SF17 72-77

4.2 Ibanga phakathi kwamabha ethusi ochungechunge lwe-SS

Amamodeli

Ibanga Eliphakathi Kwezingqimba Zethusi (mm)

I-SS11

64±3

I-SS12

64±3

I-SS13

64±3

I-SS14

74±3

I-SS15

80±3

I-SS16

90±3

5. NgobaI-heatsink epholile emoyeni, ipheya ye-heatsink ephezulu nephansi kufanele iqondaniswe kahle futhi iqonde.Ku-heatsink epholile ngamanzi, amabha ethusi aphezulu naphansi kufanele aqondaniswe futhi aqonde ku-mounting plate.

6. I-Jiangsu Yangjie Runau Semiconductor izoqhuba konke ukuhlolwa kwezingxenye ngayinye kanye nokuhlanganiswa kwezinga lokushisa elivamile elimelana nogesi kanye namapharamitha e-VGT/IGT ngaphambi kokulethwa.

Izindlela nezixwayiso ezibalulwe ngenhla yizimo ezijwayelekile zokuhlanganisa i-heatsink epholile emoyeni futhi epholile ngamanzi.Uma kunesidingo esikhethekile esivela kukhasimende, sicela uxhumane nathi uzizwe ukhululekile.Ngesikhathi esifanayo, ukuze kuqinisekiswe ukusebenza okuthembekile kwesicelo, ikakhulukazi imfunekoamandla aphezulu thyristorfuthihigh power diode, sicela uthintane namabutho okuthengisa e-Jiangsu Yangjie Runau Semiconductor Co, ukuze uthole isiphakamiso esikhethekile kanye nedivayisi ethembekile yekhwalithi ephezulu.


Isikhathi sokuthumela: Apr-28-2023